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The LSM6DS3 is a system-in-package featuring a 3D digital accelerometer and a 3D digital gyroscope performing at 1.25 mA (up to 1.6 kHz ODR) in high-performance mode and enabling always-on low-power features for an optimal motion experience for the consumer.
The LSM6DS3 supports main OS requirements, offering real, virtual and batch sensors with 8 kbyte for dynamic data batching.
ST’s family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes.
The various sensing elements are manufactured using specialized micromachining processes, while the IC interfaces are developed using CMOS technology that allows the design of a dedicated circuit which is trimmed to better match the characteristics of the sensing element.
The LSM6DS3 has a full-scale acceleration range of ±2/±4/±8/±16 g and an angular rate range of ±125/±250/±500/±1000/±2000 dps.
High robustness to mechanical shock makes the LSM6DS3 the preferred choice of system designers for the creation and manufacturing of reliable products.
The LSM6DS3 is available in a plastic land grid array (LGA) package.主要特性
- Power consumption: 0.9 mA in combo normal mode and 1.25 mA in combo high-performance mode up to 1.6 kHz.
- “Always-on” experience with low power consumption for both accelerometer and gyroscope
- Smart FIFO up to 8 kbyte based on features set
- Compliant with Android K and L
- Hard, soft ironing for external magnetic sensor corrections
- ±2/±4/±8/±16 g full scale
- ±125/±250/±500/±1000/±2000 dps full scale
- Analog supply voltage: 1.71 V to 3.6 V
- Independent IOs supply (1.62 V)
- Compact footprint, 2.5 mm x 3 mm x 0.83 mm
- SPI/I2C serial interface with main processor data synchronization feature
- Embedded temperature sensor
- ECOPACK®, RoHS and “Green” compliant
样片和购买
| 产品型号 | 封装 | 包装类型 | 供货状态 | 预算价格(US$) | 数量 | ECCN (US) | Country of Origin | 从分销商订购 | 从ST订购 |
|---|---|---|---|---|---|---|---|---|---|
| LSM6DS3TR | VFLGA 2.5X3X0.86 14L | Tape And Reel | 批量生产 | 1.771 | 1000 | EAR99 | - | 查看供货情况 | |
| LSM6DS3 | VFLGA 2.5X3X0.86 14L | Tray | 预览 | - | - | EAR99 | - | 没有经销商，请联系我们的销售办事处 |
LSM6DS3TR
封装
VFLGA 2.5X3X0.86 14L包装类型
Tape And Reel单价(US$)
1.771*LSM6DS3
封装
VFLGA 2.5X3X0.86 14L包装类型
Tray单价(US$)
*精选 视频
LSM6DSOX IMU embeds a Machine Learning Core able to run with only 5 uA, to pre-process and classify information coming from its internal gyro and accelerometer plus up to 4 external sensors to save system-level power since the main MCU can be put in sleep mode for significant amount of time.
A bridge between the sensor on the motherboard and your laptop
生态系统
软件
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Picture 产品型号 制造商 描述 
X-CUBE-MEMS-XT1 ST Sensor and DSP algorithm software expansion for STM32Cube 
X-CUBE-MEMS1 ST Sensor and motion algorithm software expansion for STM32Cube 产品型号Sensor and DSP algorithm software expansion for STM32Cube
Sensor and motion algorithm software expansion for STM32Cube
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Picture 产品型号 制造商 描述 AndroidHAL-IIO ST Android sensor HAL for MEMS motion and environmental sensors (Industrial I/O framework) AndroidHALInput ST Android sensor HAL for MEMS motion and environmental sensors (Input framework) C-Driver-MEMS ST Standard C platform-independent drivers for MEMS motion and environmental sensors LinuxDriverIIO ST Linux device drivers for MEMS motion and environmental sensors (Industrial I/O framework) LinuxDriverInput ST Linux device drivers for MEMS motion and environmental sensors (Input framework) 产品型号Android sensor HAL for MEMS motion and environmental sensors (Industrial I/O framework)
Android sensor HAL for MEMS motion and environmental sensors (Input framework)
Standard C platform-independent drivers for MEMS motion and environmental sensors
Linux device drivers for MEMS motion and environmental sensors (Industrial I/O framework)
Linux device drivers for MEMS motion and environmental sensors (Input framework)
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评估工具
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Picture 产品型号 制造商 描述 
STEVAL-MKI160V1 ST LSM6DS3 adapter board for standard DIL24 socket 产品型号LSM6DS3 adapter board for standard DIL24 socket
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Picture 产品型号 制造商 描述 
STEVAL-WESU1 ST Wearable sensor unit reference design for fast time to market 产品型号Wearable sensor unit reference design for fast time to market
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支持和应用
| 产品型号 | 供货状态 | 封装 | 符合RoHS级别 | Material Declaration** |
|---|---|---|---|---|
| LSM6DS3 | 预览 | VFLGA 2.5X3X0.86 14L | Ecopack2 | |
| LSM6DS3TR | 批量生产 | VFLGA 2.5X3X0.86 14L | Ecopack2 | |
LSM6DS3
Package:
VFLGA 2.5X3X0.86 14LMaterial Declaration**:
LSM6DS3TR
Package:
VFLGA 2.5X3X0.86 14LMaterial Declaration**:
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.
