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STM32MP157 microprocessors are based on the flexible architecture of a dual Arm® Cortex®-A7 core running at 650 MHz and the high-performance Cortex®-M4 at 209 MHz combined with a dedicated 3D graphics processing unit (GPU) and MIPI-DSI display interface and a CAN FD interface.

Specifically designed to accelerate 3D graphics in applications such as graphical user interfaces (GUI), menu displays or animations, the STM32MP157 3D OpenGL ES 2.0 graphics engine [LL1] works together with an optimized software stack design for industry-standard APIs with support for Android™ and Linux® embedded development platforms.

Compliant with MIPI® Alliance standards, the STM32MP157 display serial interface (DSI), coupled with the LCD-TFT display controller, enables an advanced user interface while granting enough resources for demanding real-time processing.

An optional security pack including true random number generators (TRNG), hardware cryptographic and hash processors as well as Secure Boot, TrustZone® peripherals, and an active tamper-detect feature is also available.

The STM32MP157 line is available in 4 different packages for a cost-efficient PCB architecture:

  • 448-pin LFBGA package: 18 x 18 mm, 0.8 mm pitch package enabling a 6-layer plated-through hole (PTH) PCB
  • 354-pin LFBGA package: 16 x 16 mm, 0.8 mm pitch package enabling a 4-layer PTH PCB
  • 361-pin TFBGA package: 12 x 12 mm, 0.5 mm pitch package enabling a 4-layer PTH or laser-drilled via PCB
  • 257-pin TFBGA package: 10 x 10 mm, 0.5 mm pitch package enabling a 4-layer PTH PCB

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