The EMIF06-VID01F2 is a 6-line highly integrated array designed to suppress EMI / RFI noise in all systems subjected to electromagnetic interference.
The EMIF06-VID01F2 Flip Chip packaging means the package size is equal to the die size.
Additionally, this filter includes ESD protection circuitry which prevents damage to the protected device when subjected to ESD surges up to 15 kV.
|DS4228: 6-line IPAD™, low capacitance EMI filter and ESD protection||2.1||166 KB|
|AN3353: IEC 61000-4-2 standard testing||1.2||171 KB|
|AN2348: IPAD™ 400 µm Flip Chip: package description and recommendations for use||5.0||261 KB|
|AN1235: IPAD™ 500 µm Flip Chip: package description and recommendations for use||8.0||251 KB|
|TA0318: EMI and ESD consideration for LCD and cameras in wireless handsets||1.2||115 KB|
|TN1173: Packing information for IPAD™, protection, rectifiers, thyristors and AC Switches||5.0||1 MB|
|Part Number||Package||Packing Type||Marketing Status||Unit Price (US$) *||Quantity||ECCN (US)||Country of Origin||More info||Order from ST||Order from Distributors|
|EMIF06-VID01F2||Chip Scale Package 0.5mm pitch||Tape And Reel||Active : Product is in volume production||0.314||100||EAR99||CHINA||MORE INFO||No availability reported, please contact our Sales office|
|Part Number||Marketing Status||Package||Grade||RoHS Compliance Grade||Material Declaration**|
|EMIF06-VID01F2||Active||Chip Scale Package 0.5mm pitch||Industrial||Ecopack2|
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.