The EMIF08-VID01F2 is an 8 line highly integrated device designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interference. The flip chip packaging means the package size is equal to the die size.
This filter includes ESD protection circuitry, which prevents damage to the application when it is subjected to ESD surges up to 15kV.
|DS4376: 8 line low capacitance EMI filter and ESD protection||2.2||486.9 KB|
|AN3353: IEC 61000-4-2 standard testing||1.2||171.08 KB|
|AN2348: IPAD™ 400 µm Flip Chip: package description and recommendations for use||5.0||261.7 KB|
|AN1235: IPAD™ 500 µm Flip Chip: package description and recommendations for use||8.0||251.82 KB|
|TA0318: EMI and ESD consideration for LCD and cameras in wireless handsets||1.2||115.85 KB|
|TN1173: Packing information for IPAD™, protection, rectifiers, thyristors and AC Switches||5.0||1.04 MB|
|emif08-vid01f2 OrCad Symbol and Footprint files||1.0||18.3 KB|
|Part Number||Package||Packing Type||Marketing Status||Unit Price (US$) *||Quantity||ECCN (US)||Country of Origin||More info||Order from ST||Order from Distributors|
|EMIF08-VID01F2||Chip Scale Package 0.5mm pitch||Tape And Reel||Active : Product is in volume production||0.487||1000||EAR99||CHINA||MORE INFO||DISTRIBUTOR AVAILABILITY|
|Part Number||Marketing Status||Package||Grade||RoHS Compliance Grade||Material Declaration**|
|EMIF08-VID01F2||Active||Chip Scale Package 0.5mm pitch||Industrial||Ecopack2|
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.