ST’s IGBTs are based on advanced proprietary trench field-stop (TFS) technology and feature the world's best trade-off between static and dynamic characteristics, while a maximum junction temperature (Tj max.) of 175 ˚C increases device reliability and lifetime. The bare die IGBTs are available in different trade-offs, with a maximum voltage of 1700V and a collector current up to 200A, for a wide range of applications like motor control, servo drives, welding, solar and traction inverters.Different packing options are offered such as wafers on sticky foil or sealed die in tape & reel.For automotive products, the availability of KGD (known good die) testing equipment ensures a high degree of reliability and quality thanks to extensive testing and inspection.
ST’s KGD testing includes:
- Die traceability (wafer lot, wafer number, die positioning inside wafer and datalog)
- Top-side and back-side 100% visual inspection
- 100% coverage of datasheet in terms of testing
Moreover, ST is also available to create new IGBT die form products upon request.
Our wide STPOWER product portfolio combined with state-of-the art packaging and protections for high reliability and safety helps designers find the right solutions for customized, high-efficiency applications that will last a long lifetime.