The RF integrated passive device (RF IPD) uses a high-resistivity substrate to integrate quality factor components such as capacitors and indictors. Many functions like impedance matching networks, harmonic filters, couplers, baluns, and power combiners/splitters can be designed using IPD technology. ST's IPDs are manufactured using thick film and HiRes Si or glass wafer manufacturing technology and photolithography processing.
Integrated passive device (IPD)
ST's IPD process can integrate high-quality passive elements (resistors, inductors, and capacitors) on glass and high resistivity silicon substrates in various design configurations.
Advanced design system (ADS)
ADS covers a broad spectrum and power needs of new wireless applications.
The complete ADS suite includes layouts and effective EM simulation support. Partners can now take advantage of STMicroelectronics superior IPD process and design tools offered by ST's RF IPD foundry service.
High quality-factor RF integrated passive process
They are used in different types of RF applications with cost sensitivity and high efficiency requirements.
Baluns help balance unbalanced signals. They use ST's RF IPD process to integrate high-quality passive RF components in a single glass substrate. In addition to symmetric/asymmetric transformations, matching networks can also be integrated into footprints less than 1 mm2 for full functionality.Learn more
RF Filters are used for functions like band-pass filters and low-pass or high-pass filters in RF front ends. RF filters can easily be integrated into front-end modules thanks to ST's thin-film RF IPD process for integrating high-quality passive RF components into a single glass or high-resistivity silicon substrate.Learn more
Our IPD technology covers all RF applications with a frequency range from 168MHz and above, such as:
Key benefits of ST RF front-end:
ST's IPDs available as standalone products such as baluns and filters as well as foundry services. They are compatible with different assembly modes, including CSP, microbumping, and wire bonding, for mounting on the main printed wiring board (PWB) or in a complete RF module.