BALF-CC25-02D3

批量生产

50Ω / conjugate match to CC2541

下载数据手册

Order from our eStore and our distributors

立即购买
概述
工具与软件
资源
解决方案
质量与可靠性
Sales Briefcase
eDesignSuite
开始
样片和购买
Partner products
  • STMicroelectronics BAL-CC25-02D3 is an ultra miniature balun which integrates a matching network in a monolithic glass substrate. This has been customized for the CC2541 RF transceivers.

    It’s a design using STMicroelectronics IPD (integrated passive device) technology on non-conductive glass substrate to optimize RF performance.

    主要特性

    • 2.45 GHz balun with integrated matching network
    • Matching optimized for following CC2541
    • Low insertion loss
    • Low amplitude imbalance
    • Low phase imbalance
    • Coated Flip-Chip on glass
    • Small footprint: < 0.88 mm²
    • Benefits
      • Very low profile
      • High RF performance
      • PCB space saving versus discrete solution
      • BOM count reduction
      • Efficient manufacturability

样片和购买

产品型号
封装
包装类型
Minimum Sellable Quantity
供货状态
预算价格(US$)
数量
ECCN (US)
Country of Origin
从分销商订购
从ST订购
BALF-CC25-02D3 Chip Scale Package 0.4mm pitch Tape And Reel 5000
批量生产
0.142 500 EAR99 CHINA 查看供货情况

Distributor availability ofBALF-CC25-02D3

代理商名称
地区 库存 最小订购量 Third party link
ARROW EUROPE 10000 0 Order Now
Newark Element14 AMERICA 10000 0 Order Now

代理商库存报告日期: 2019-12-13

代理商名称

ARROW

库存

10000

Min.Order

0

地区

EUROPE Order Now

Newark Element14

库存

10000

Min.Order

0

地区

AMERICA Order Now

代理商库存报告日期: 2019-12-13

立即购买

BALF-CC25-02D3

封装

Chip Scale Package 0.4mm pitch

包装类型

Tape And Reel

单价(US$)

0.142*

Distributor availability ofBALF-CC25-02D3

代理商名称
地区 库存 最小订购量 Third party link
ARROW EUROPE 10000 0 Order Now
Newark Element14 AMERICA 10000 0 Order Now

代理商库存报告日期: 2019-12-13

代理商名称

ARROW

库存

10000

Min.Order

0

地区

EUROPE Order Now

Newark Element14

库存

10000

Min.Order

0

地区

AMERICA Order Now

代理商库存报告日期: 2019-12-13

Minimum Sellable Quantity

5000

供货状态

批量生产

单价(US$)

0.142

数量

500

ECCN (US)

EAR99

Country of Origin

CHINA

(*) 建议转售单价(美元)仅用于预算用途。如需以当地货币计价的报价,请联系您当地的 ST销售办事处 或我们的 经销商

适合您的资源

00 选择要下载的文档

技术文档

    • 描述 版本 文档大小 操作
      DS11378
      50 ohm, conjugate match to CC2541 transformer balun
      1.0
      610.38 KB
      PDF
      DS11378

      50 ohm, conjugate match to CC2541 transformer balun

    • 描述 版本 文档大小 操作
      AN4315
      BAL-NRF02D3 matched balun with integrated harmonics filter for Nordic Semiconductor chips with ultralow power transceivers
      2.2
      687.23 KB
      PDF
      AN2348
      IPAD™ 400 µm Flip Chip: package description and recommendations for use
      5.0
      261.7 KB
      PDF
      AN1235
      IPAD™ 500 µm Flip Chip: package description and recommendations for use
      8.0
      251.82 KB
      PDF
      AN4315

      BAL-NRF02D3 matched balun with integrated harmonics filter for Nordic Semiconductor chips with ultralow power transceivers

      AN2348

      IPAD™ 400 µm Flip Chip: package description and recommendations for use

      AN1235

      IPAD™ 500 µm Flip Chip: package description and recommendations for use

    • 描述 版本 文档大小 操作
      TN1173
      Packing information for IPAD, protection, rectifiers, thyristors and AC Switches
      6.0
      444.57 KB
      PDF
      TN1173

      Packing information for IPAD, protection, rectifiers, thyristors and AC Switches

硬件型号、CAD库及SVD

    • 描述 版本 文档大小 操作
      balf-cc25-02d3 OrCad Symbol and Footprint files 1.0
      12.53 KB
      ZIP

      balf-cc25-02d3 OrCad Symbol and Footprint files

出版刊物和宣传资料

    • 描述 版本 文档大小 操作
      Tiniest Matched Baluns for Wifi, Bluetooth & Sub-GHz 1.0
      951.55 KB
      PDF

      Tiniest Matched Baluns for Wifi, Bluetooth & Sub-GHz

    • 描述 版本 文档大小 操作
      Products and solutions for Smart industry 3.0
      3.32 MB
      PDF
      Semiconductor solutions for healthcare applications 1.0
      665.18 KB
      PDF

      Products and solutions for Smart industry

      Semiconductor solutions for healthcare applications

产品型号 供货状态 封装 等级规格 符合RoHS级别 Material Declaration**
BALF-CC25-02D3
批量生产
Chip Scale Package 0.4mm pitch 工业 Ecopack2

BALF-CC25-02D3

Package:

Chip Scale Package 0.4mm pitch

Material Declaration**:

Marketing Status

批量生产

Package

Chip Scale Package 0.4mm pitch

Grade

Industrial

RoHS Compliance Grade

Ecopack2

(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.

支持中心或 提供反馈