8-line EMI filter and ESD protection for display interfaces

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  • The EMIF08-VID01F2 is an 8 line highly integrated device designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interference. The flip chip packaging means the package size is equal to the die size.

    This filter includes ESD protection circuitry, which prevents damage to the application when it is subjected to ESD surges up to 15kV.

    主要特性

    • Main product characteristicsWhere EMI filtering in ESD sensitive equipment is required:LCD & camera for mobile phonesComputers and printers Communication systemsMCU Boards

样片和购买

产品型号
封装
包装类型
供货状态
预算价格(US$)
数量
ECCN (US)
Country of Origin
从分销商订购
从ST订购
EMIF08-VID01F2 Chip Scale Package 0.5mm pitch Tape And Reel
批量生产
0.487 1000 EAR99 CHINA 查看供货情况

Distributor availability ofEMIF08-VID01F2

代理商名称
地区 库存 最小订购量 Third party link
ARROW AMERICA 5000 5000 Order Now

代理商库存报告日期: 2019-10-27

代理商名称

ARROW

库存

5000

Min.Order

5000

地区

AMERICA Order Now

代理商库存报告日期: 2019-10-27

EMIF08-VID01F2

封装

Chip Scale Package 0.5mm pitch

包装类型

Tape And Reel

单价(US$)

0.487*

Distributor availability ofEMIF08-VID01F2

代理商名称
地区 库存 最小订购量 Third party link
ARROW AMERICA 5000 5000 Order Now

代理商库存报告日期: 2019-10-27

代理商名称

ARROW

库存

5000

Min.Order

5000

地区

AMERICA Order Now

代理商库存报告日期: 2019-10-27

供货状态

批量生产

单价(US$)

0.487

数量

1000

ECCN (US)

EAR99

Country of Origin

CHINA

(*) 建议转售单价(美元)仅用于预算用途。如需以当地货币计价的报价,请联系您当地的 ST销售办事处 或我们的 经销商

适合您的资源

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技术文档

    • 描述 版本 文档大小 操作
      DS4376
      8 line low capacitance EMI filter and ESD protection
      2.2
      486.9 KB
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      DS4376

      8 line low capacitance EMI filter and ESD protection

    • 描述 版本 文档大小 操作
      AN5241
      Fundamentals of ESD protection at system level
      1.1
      1.45 MB
      PDF
      AN3353
      IEC 61000-4-2 standard testing
      1.2
      171.08 KB
      PDF
      AN2348
      IPAD™ 400 µm Flip Chip: package description and recommendations for use
      5.0
      261.7 KB
      PDF
      AN1235
      IPAD™ 500 µm Flip Chip: package description and recommendations for use
      8.0
      251.82 KB
      PDF
      AN5241

      Fundamentals of ESD protection at system level

      AN3353

      IEC 61000-4-2 standard testing

      AN2348

      IPAD™ 400 µm Flip Chip: package description and recommendations for use

      AN1235

      IPAD™ 500 µm Flip Chip: package description and recommendations for use

    • 描述 版本 文档大小 操作
      TA0318
      EMI and ESD consideration for LCD and cameras in wireless handsets
      1.2
      115.85 KB
      PDF
      TN1173
      Packing information for IPAD, protection, rectifiers, thyristors and AC Switches
      6.0
      444.57 KB
      PDF
      TA0318

      EMI and ESD consideration for LCD and cameras in wireless handsets

      TN1173

      Packing information for IPAD, protection, rectifiers, thyristors and AC Switches

硬件型号、CAD库及SVD

    • 描述 版本 文档大小 操作
      emif08-vid01f2 OrCad Symbol and Footprint files 1.0
      18.3 KB
      ZIP

      emif08-vid01f2 OrCad Symbol and Footprint files

产品型号 供货状态 封装 等级规格 符合RoHS级别 材料声明**
EMIF08-VID01F2
批量生产
Chip Scale Package 0.5mm pitch 工业 Ecopack2

EMIF08-VID01F2

Package:

Chip Scale Package 0.5mm pitch

Material Declaration**:

PDF XML

Marketing Status

批量生产

Package

Chip Scale Package 0.5mm pitch

Grade

Industrial

RoHS Compliance Grade

Ecopack2

(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.