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  • This is a highly integrated 8-line device designed to suppress EMI/RFI noise in all systems exposed to electromagnetic interference.

    This filter includes ESD protection circuitry, which prevents the application from damages when subjected to ESD surges up to 20 kV.

    Key Features

    • High efficiency in EMI filtering in wide filter bandwidth: better than -25 dB from 700MHz to 3.0 GHz
    • Very thin package: 0.6 mm max.
    • High efficiency in ESD suppression on all input and output pins (exceeds IEC61000-4-2 level 4: ±20 kV contact discharge)
    • High reliability offered by monolithic integration
    • High reduction of parasitic elements through integration and wafer level packaging

样片和购买

产品型号
封装
包装类型
供货状态
预算价格(US$)
数量
ECCN (US)
Country of Origin
从分销商订购
从ST订购
EMIF08-VID1F3 Chip Scale Package 0.4mm pitch Tape And Reel
批量生产
0.19 500 EAR99 CHINA 没有经销商,请联系我们的销售办事处

EMIF08-VID1F3

封装

Chip Scale Package 0.4mm pitch

包装类型

Tape And Reel

单价(US$)

0.19*

供货状态

批量生产

单价(US$)

0.19

数量

500

ECCN (US)

EAR99

Country of Origin

CHINA

(*) 建议转售单价(美元)仅用于预算用途。如需以当地货币计价的报价,请联系您当地的 ST销售办事处 或我们的 经销商

适合您的资源

00 选择要下载的文档

技术文档

    • 描述 版本 文档大小 操作
      DS12068
      8-line low capacitance EMI filter and ESD protection
      1.0
      576.21 KB
      PDF
      DS12068

      8-line low capacitance EMI filter and ESD protection

    • 描述 版本 文档大小 操作
      AN5241
      Fundamentals of ESD protection at system level
      1.1
      1.45 MB
      PDF
      AN3353
      IEC 61000-4-2 standard testing
      1.2
      171.08 KB
      PDF
      AN2348
      IPAD™ 400 µm Flip Chip: package description and recommendations for use
      5.0
      261.7 KB
      PDF
      AN1235
      IPAD™ 500 µm Flip Chip: package description and recommendations for use
      8.0
      251.82 KB
      PDF
      AN5241

      Fundamentals of ESD protection at system level

      AN3353

      IEC 61000-4-2 standard testing

      AN2348

      IPAD™ 400 µm Flip Chip: package description and recommendations for use

      AN1235

      IPAD™ 500 µm Flip Chip: package description and recommendations for use

    • 描述 版本 文档大小 操作
      TA0318
      EMI and ESD consideration for LCD and cameras in wireless handsets
      1.2
      115.85 KB
      PDF
      TN1173
      Packing information for IPAD, protection, rectifiers, thyristors and AC Switches
      6.0
      444.57 KB
      PDF
      TA0318

      EMI and ESD consideration for LCD and cameras in wireless handsets

      TN1173

      Packing information for IPAD, protection, rectifiers, thyristors and AC Switches

产品型号 供货状态 封装 等级规格 符合RoHS级别 Material Declaration**
EMIF08-VID1F3
批量生产
Chip Scale Package 0.4mm pitch 工业 Ecopack2

EMIF08-VID1F3

Package:

Chip Scale Package 0.4mm pitch

Material Declaration**:

PDF XML

Marketing Status

批量生产

Package

Chip Scale Package 0.4mm pitch

Grade

Industrial

RoHS Compliance Grade

Ecopack2

(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.