ST’s IPD process is able to integrate high-quality passive elements (resistors, inductors, capacitors) on glass sand high resistivity silicon substrates and in various design configurations. Available IPs are baluns, RF couplers, combiners, filters, diplexers, triplexers, and impedance matching. Today’s standard product offering includes baluns, RF couplers, filters and diplexers.
The IPD technology is able to cover all RF applications with a frequency range from 168 MHz and above, such as Sub-Giga, WLAN, Bluetooth, ZigBee, WiMax, UWB, UMTS, LTE and more. The key benefits of this technology are a competitive cost structure, a small form factor, and reduced power losses.
ST’s IPD products are compatible with different assembly modes including CSP, microbumping and wirebonding, to be mounted either on the main PWB or inside a complete RF module.
Smart Antenna Tuning with STMicroelectronics (all LTE bands)
Antenna desense medication with ECMF™ common-mode filters integrating ESD protection
STHVDAC, STPTIC: better sensitivity and longer battery life
BALF-SPI2-02D3 for 433-470 MHz S2-LP-based RF applications
BALF-SPI2-01D3, for 868-927 MHz S2-LP-based RF applications
Simplified RF design for optimized performance
for Nordic Semi nRF51822-CEAA & nRF51422-CEAA SoCs transceivers