iNEMO 6DoF inertial measurement unit (IMU), for entry level / mid-tier smart phones and Portable PC platforms

下载数据手册
概述
工具与软件
资源
解决方案
质量与可靠性
Sales Briefcase
eDesignSuite
开始
样片和购买
Partner products
  • The LSM6DS3TR-C is a system-in-package featuring a 3D digital accelerometer and a 3D digital gyroscope performing at 0.90 mA in high-performance mode and enabling always-on low-power features for an optimal motion experience for the consumer.

    The LSM6DS3TR-C supports main OS requirements, offering real, virtual and batch sensors with 4 kbyte for dynamic data batching.
    ST’s family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes.
    The various sensing elements are manufactured using specialized micromachining processes, while the IC interfaces are developed using CMOS technology that allows the design of a dedicated circuit which is trimmed to better match the characteristics of the sensing element.
    The LSM6DS3TR-C has a full-scale acceleration range of ±2/±4/±8/±16 g and an angular rate range of ±125/±250/±500/±1000/±2000 dps.
    High robustness to mechanical shock makes the LSM6DS3TR-C the preferred choice of system designers for the creation and manufacturing of reliable products.
    The LSM6DS3TR-C is available in a plastic land grid array (LGA) package.

    主要特性

    • “Always-on” experience with low power consumption for both accelerometer and gyroscope
    • Power consumption: 0.90 mA in combo high-performance mode
    • Smart FIFO up to 4 kbyte based on features set
    • Android M compliant
    • Hard, soft ironing for external magnetic sensor corrections
    • ±2/±4/±8/±16 g full scale
    • ±125/±250/±500/±1000/±2000 dps full scale
    • Analog supply voltage: 1.71 V to 3.6 V
    • Independent IO supply (1.62 V)
    • Compact footprint, 2.5 mm x 3 mm x 0.83 mm
    • SPI & I2C serial interface with main processor data synchronization feature
    • Pedometer, step detector and step counter
    • Significant motion and tilt function
    • Standard interrupts: free-fall, wakeup, 6D/4D orientation, click and double-click
    • Embedded temperature sensor
    • ECOPACK®, RoHS and “Green” compliant

样片和购买

产品型号
封装
包装类型
供货状态
预算价格(US$)
数量
ECCN (US)
Country of Origin
从分销商订购
从ST订购
LSM6DS3TR-C VFLGA2.5X3X.86 14L P.5 L.475X.25 Tape And Reel
批量生产
- - EAR99 PHILIPPINES 没有经销商,请联系我们的销售办事处

LSM6DS3TR-C

封装

VFLGA2.5X3X.86 14L P.5 L.475X.25

包装类型

Tape And Reel

单价(US$)

*

供货状态

批量生产

单价(US$)

-

数量

-

ECCN (US)

EAR99

Country of Origin

PHILIPPINES

(*) 建议转售单价(美元)仅用于预算用途。如需以当地货币计价的报价,请联系您当地的 ST销售办事处 或我们的 经销商

适合您的资源

生态系统

    • 产品型号

      AWS IoT Core is a managed cloud service that lets connected devices easily and securely interact with cloud applications and other devices

      Microsoft Azure is an ever-expanding set of cloud services to help your organization meet your business challenges. It's the freedom to build, manage, and deploy applications on a massive, global network using your favorite tools and frameworks.

      IBM Watson IoT Platform is a managed, cloud-hosted service designed to make it simple to derive value from your Internet of Things devices.

支持和应用

    • 产品型号

      Engineering services on theSensorTile.box surch as Plastic housing, HW and SW/App customizations and boards Manufacturing.

00 选择要下载的文档

技术文档

    • 描述 版本 文档大小 操作
      DS11937
      iNEMO inertial module: always-on 3D accelerometer and 3D gyroscope
      3.0
      1.75 MB
      PDF
      DS11937

      iNEMO inertial module: always-on 3D accelerometer and 3D gyroscope

    • 描述 版本 文档大小 操作
      AN5130
      LSM6DS3TR-C: always-on 3D accelerometer and 3D gyroscope
      1.0
      1.5 MB
      PDF
      AN5130

      LSM6DS3TR-C: always-on 3D accelerometer and 3D gyroscope

    • 描述 版本 文档大小 操作
      TN0018
      LGA 封装中MEMS 传感器的表面贴装指南
      1.0
      251.2 KB
      PDF
      TN0018

      LGA 封装中MEMS 传感器的表面贴装指南

    • 描述 版本 文档大小 操作
      DT0105
      1-point or 3-point tumble sensor calibration
      1.0
      148.7 KB
      PDF
      DT0064
      MEMS 传感器中的噪声分析和识别,Allan,时间,Hadamard,重叠,修正,总体方差
      1.0
      673.72 KB
      PDF
      DT0106
      Residual linear acceleration by gravity subtraction to enable dead-reckoning
      1.0
      192.08 KB
      PDF
      DT0105

      1-point or 3-point tumble sensor calibration

      DT0064

      MEMS 传感器中的噪声分析和识别,Allan,时间,Hadamard,重叠,修正,总体方差

      DT0106

      Residual linear acceleration by gravity subtraction to enable dead-reckoning

出版刊物和宣传资料

    • 描述 版本 文档大小 操作
      LSM6DSOX iNEMO 6-axis inertial module with Machine Learning core 1.0
      1.05 MB
      PDF

      LSM6DSOX iNEMO 6-axis inertial module with Machine Learning core

    • 描述 版本 文档大小 操作
      MEMS Sensors for automotive applications 1.0
      3.33 MB
      PDF
      MEMS和传感器 智能运动追踪、IoT和增强用户体验 1.0
      11.08 MB
      PDF
      Sensor & motion algorithm software pack for STM32Cube 1.0
      544.58 KB
      PDF

      MEMS Sensors for automotive applications

      MEMS和传感器 智能运动追踪、IoT和增强用户体验

      Sensor & motion algorithm software pack for STM32Cube

产品型号 供货状态 封装 符合RoHS级别 Material Declaration**
LSM6DS3TR-C
批量生产
VFLGA2.5X3X.86 14L P.5 L.475X.25 Ecopack2

LSM6DS3TR-C

Package:

VFLGA2.5X3X.86 14L P.5 L.475X.25

Material Declaration**:

PDF XML

Marketing Status

批量生产

Package

VFLGA2.5X3X.86 14L P.5 L.475X.25

RoHS Compliance Grade

Ecopack2

(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.

支持中心或 提供反馈