LSM6DS3TR-C

批量生产

用于入门级/中档智能手机和便携式电脑平台的iNEMO 6DoF惯性测量单元(IMU)

下载数据手册
概述
样片和购买
解决方案
资源
工具与软件
质量与可靠性
eDesignSuite
开始
Partner products
Sales Briefcase
  • The LSM6DS3TR-C is a system-in-package featuring a 3D digital accelerometer and a 3D digital gyroscope performing at 0.90 mA in high-performance mode and enabling always-on low-power features for an optimal motion experience for the consumer.

    The LSM6DS3TR-C supports main OS requirements, offering real, virtual and batch sensors with 4 kbyte for dynamic data batching.
    ST’s family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes.
    The various sensing elements are manufactured using specialized micromachining processes, while the IC interfaces are developed using CMOS technology that allows the design of a dedicated circuit which is trimmed to better match the characteristics of the sensing element.
    The LSM6DS3TR-C has a full-scale acceleration range of ±2/±4/±8/±16 g and an angular rate range of ±125/±250/±500/±1000/±2000 dps.
    High robustness to mechanical shock makes the LSM6DS3TR-C the preferred choice of system designers for the creation and manufacturing of reliable products.
    The LSM6DS3TR-C is available in a plastic land grid array (LGA) package.

    主要特性

    • “Always-on” experience with low power consumption for both accelerometer and gyroscope
    • Power consumption: 0.90 mA in combo high-performance mode
    • Smart FIFO up to 4 kbyte based on features set
    • Android M compliant
    • Hard, soft ironing for external magnetic sensor corrections
    • ±2/±4/±8/±16 g full scale
    • ±125/±250/±500/±1000/±2000 dps full scale
    • Analog supply voltage: 1.71 V to 3.6 V
    • Independent IO supply (1.62 V)
    • Compact footprint, 2.5 mm x 3 mm x 0.83 mm
    • SPI & I2C serial interface with main processor data synchronization feature
    • Pedometer, step detector and step counter
    • Significant motion and tilt function
    • Standard interrupts: free-fall, wakeup, 6D/4D orientation, click and double-click
    • Embedded temperature sensor
    • ECOPACK®, RoHS and “Green” compliant

适合您的资源

生态系统

    • 产品型号

      AWS IoT Core是托管的云服务,使连接的设备能够轻松并安全地与云应用和其他设备交互。

      Microsoft Azure是一组不断扩展的云服务,可帮助您的公司解决业务方面的挑战。您可以使用您喜爱的工具和框架,在巨大的全球网络上自由地构建、管理和部署应用。

      IBM Watson IoT平台是一种云托管服务,用于简化从物联网设备获取值的过程。

    • 产品型号

      High-performance inertial platform.

      即用型BLE模块上系统包含了传感器、低功耗ARM® 32位Cortex®-M4 CPU和纽扣电池。立即行动,加快IoT产品开发速度!

      将低功耗SUB 1GHZ RF收发器连接到云,具有完全可定制的传感器、ARM® 32位Cortex®-M4 CPU和纽扣电池。

软件

    • 产品型号

      独立于标准C平台的驱动,用于MEMS运动和环境传感器

支持和应用

00 选择要下载的文档

技术文档

    • 描述 版本 文档大小 操作
      DS11937
      iNEMO inertial module: always-on 3D accelerometer and 3D gyroscope
      3.0
      1.75 MB
      PDF
      DS11937

      iNEMO inertial module: always-on 3D accelerometer and 3D gyroscope

    • 描述 版本 文档大小 操作
      AN5130
      LSM6DS3TR-C: always-on 3D accelerometer and 3D gyroscope
      1.0
      1.5 MB
      PDF
      AN5130

      LSM6DS3TR-C: always-on 3D accelerometer and 3D gyroscope

    • 描述 版本 文档大小 操作
      TN0018
      LGA 封装中MEMS 传感器的表面贴装指南
      1.0
      251.2 KB
      PDF
      TN0018

      LGA 封装中MEMS 传感器的表面贴装指南

    • 描述 版本 文档大小 操作
      DT0105
      1-point or 3-point tumble sensor calibration
      1.0
      148.7 KB
      PDF
      DT0064
      MEMS 传感器中的噪声分析和识别,Allan,时间,Hadamard,重叠,修正,总体方差
      1.0
      673.72 KB
      PDF
      DT0106
      Residual linear acceleration by gravity subtraction to enable dead-reckoning
      1.0
      192.08 KB
      PDF
      DT0105

      1-point or 3-point tumble sensor calibration

      DT0064

      MEMS 传感器中的噪声分析和识别,Allan,时间,Hadamard,重叠,修正,总体方差

      DT0106

      Residual linear acceleration by gravity subtraction to enable dead-reckoning

出版刊物和宣传资料

    • 描述 版本 文档大小 操作
      ISM330DHCX iNEMO 6-axis inertial module with Machine Learning Core for IIoT 1.0
      113.79 KB
      PDF
      LSM6DSOX iNEMO 6-axis inertial module with Machine Learning core 2.0
      139.18 KB
      PDF
      LSM6DSRX iNEMO 6-axis inertial module with Machine Learning core 1.0
      98.3 KB
      PDF

      ISM330DHCX iNEMO 6-axis inertial module with Machine Learning Core for IIoT

      LSM6DSOX iNEMO 6-axis inertial module with Machine Learning core

      LSM6DSRX iNEMO 6-axis inertial module with Machine Learning core

    • 描述 版本 文档大小 操作
      MEMS Sensors for automotive applications 1.0
      3.33 MB
      PDF
      MEMS and Sensors Quick Reference Guide 1.1
      919.75 KB
      PDF
      MEMS and Sensors Smart Motion tracking, IoT for an enhanced user experience 1.0
      4.21 MB
      PDF
      Sensor & motion algorithm software pack for STM32Cube 1.0
      544.58 KB
      PDF

      MEMS Sensors for automotive applications

      MEMS and Sensors Quick Reference Guide

      MEMS and Sensors Smart Motion tracking, IoT for an enhanced user experience

      Sensor & motion algorithm software pack for STM32Cube

质量与可靠性

产品型号 供货状态 封装 符合RoHS级别 材料声明**
LSM6DS3TR-C
批量生产
VFLGA2.5X3X.86 14L P.5 L.475X.25 Ecopack2

LSM6DS3TR-C

Package:

VFLGA2.5X3X.86 14L P.5 L.475X.25

Material Declaration**:

PDF XML

Marketing Status

批量生产

Package

VFLGA2.5X3X.86 14L P.5 L.475X.25

RoHS Compliance Grade

Ecopack2

(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此,它们可能不是100%适用于特定的设备。有关特定设备的信息,请联系 销售支持

样片和购买

产品型号
从分销商订购
从ST订购
封装
包装类型
供货状态
ECCN (US)
Country of Origin
Budgetary Price (US$)*/Qty
LSM6DS3TR-C 没有经销商,请联系我们的销售办事处 VFLGA2.5X3X.86 14L P.5 L.475X.25 Tape And Reel
批量生产
EAR99 PHILIPPINES

LSM6DS3TR-C

封装

VFLGA2.5X3X.86 14L P.5 L.475X.25

包装类型

Tape And Reel

Budgetary Price (US$)*/Qty

供货状态

批量生产

Budgetary Price (US$)* / Qty

ECCN (US)

EAR99

Country of Origin

PHILIPPINES

(*) 建议转售单价(美元)仅用于预算用途。如需以当地货币计价的报价,请联系您当地的 ST销售办事处 或我们的 经销商