Leveraging its proprietary trench field-stop technology, ST offers bare die IGBTs for custom designs. For automotive products, the availability of KGD (known good die) testing equipment ensures a high degree of reliability and quality thanks to extensive testing and inspection.
ST’s KGD testing includes:
- Die traceability (wafer lot, wafer number, die positioning inside wafer, and datalog)
- Top side and back side 100% visual inspection
- 100% coverage of datasheet in terms of testing
ST is also available to create new IGBT die form products on request.
The bare die IGBTs are available in different packing options, such as wafers on sticky foil or sealed die in Tape & Reel.
精选 视频
- STG35M120F3D7 1200 V, 35 A trench gate field-stop M series, low-loss IGBT die in D7 packing
- STG25M120F3D7 1200 V, 25 A trench gate field-stop M series low-loss IGBT die in D7 packing
- STG40M120F3D7 1200 V, 40 A trench gate field-stop M series low-loss IGBT die in D7 packing
- STG10M65F2D7 Trench gate field-stop, 650 V, 10 A, low-loss M series IGBT die in D7 packing
- STG200M65F2D8AG Automotive-grade 650 V, 200 A trench gate field-stop M series IGBT die in D8 packing
- STG30M65F2D7 Trench gate field-stop 650 V, 30 A low-loss M series IGBT die in D7 packing
- STG15M65F2D7 Trench gate field-stop 650 V, 15 A low-loss M series IGBT die in D7 packing
- STG8M120F3D7 1200 V, 8 A trench gate field-stop M series low-loss IGBT die in D7 packing
- STG20M65F2D7 650 V, 20 A trench gate field-stop M series low loss IGBT in D7 packing
- STG50M65F2D7 650 V, 50 A trench gate field-stop M series low-loss IGBT die in D7 packing
