ST23 Contactless Secure MCU with 8 KBytes EEPROM, enhanced security and DES/AES cryptoprocessor, RF Type A,B,B'

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  • ST23ZC08 products are secure microcontrollers specially designed for secure smartcard applications.

    They are based on an enhanced STMicroelectronics 8/16-bit CPU core offering 16 Mbytes of linear addressing space. ST23ZC08 devices are manufactured using an advanced highly reliable ST CMOS EEPROM technology.

    主要特性

    • Hardware features
      • Enhanced 8/16-bit ST23 CPU core with 16 Mbytes of linear addressable memory
      • 92 Kbytes of User ROM
      • 4 Kbytes of User RAM
      • 0.5 Kbytes dedicated RFUART RAM
      • 8 Kbytes of User EEPROM including 128 Bytes of User OTP area:
        • Highly reliable CMOS EEPROM submicron technology
        • 30-year data retention at 25°C
        • 500,000 Erase/Write cycles endurance at 25° C
        • 1 to 32 byte Erase or Program in 1.5 ms
      • Operating temperature: –25° to +85°C (see restricted test conditions)
      • Three 8-bit timers with watchdog and interrupt capability
      • High performance provided by:
        • CPU clock frequency up to 28 MHz
      • Power-saving Standby state
      • ESD protection greater than 5 kV (HBM)
    • Contactless features
      • Complies with ISO/IEC 14443 Type A, B and B’, and PayPass™ standards
      • 13.56 MHz carrier frequency
      • RF frame up to 512 bytes
      • RFUART (RF universal asynchronous receiver transmitter) up to 848 Kbps
    • Security features
      • Active shield
      • Monitoring of environmental parameters
      • Protection mechanisms against faults
      • True random number generator (TRNG) (AIS-31 Class P2 compliant)
      • 16-bit Cyclic Redundancy Check (CRC) calculation block (ISO/IEC 13239)
      • Unique serial number on each die
      • AES accelerator
      • Three-key Triple DES accelerator (EDES+)
    • Development environment
      • C compiler, simulator and emulator

样片和购买

产品型号
供货状态
封装
ECCN (EU)
Country of Origin
从分销商订购
从ST订购
ST23ZC08
批量生产
DICE NEC - 没有经销商,请联系我们的销售办事处

ST23ZC08

供货状态

批量生产

封装

DICE

ECCN (EU)

NEC

Country of Origin

-

(*) 建议转售单价(美元)仅用于预算用途。如需以当地货币计价的报价,请联系您当地的 ST销售办事处 或我们的 经销商

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技术文档

    • 描述 版本 文档大小 操作
      DB1319
      Secure microcontroller with enhanced security with 8 Kbytes EEPROM and contactless-only interface
      2.1
      101.65 KB
      PDF
      DB1319

      Secure microcontroller with enhanced security with 8 Kbytes EEPROM and contactless-only interface

出版刊物和宣传资料

    • 描述 版本 文档大小 操作
      Brochure Secure MCUs - Secure Solutions 1.0
      1.48 MB
      PDF

      Brochure Secure MCUs - Secure Solutions

产品型号 供货状态 封装 等级规格 符合RoHS级别 Material Declaration**
ST23ZC08
批量生产
DICE 工业 N/A

ST23ZC08

Package:

DICE

Material Declaration**:

Marketing Status

批量生产

Package

DICE

Grade

Industrial

RoHS Compliance Grade

N/A

(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.

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