产品概述
描述
This silicon carbide Power MOSFET device has been developed using ST’s advanced and innovative 3rd generation SiC MOSFET technology. The device features a very low RDS(on) over the entire temperature range combined with low capacitances and very high switching operations, which improve application performance in frequency, energy efficiency, system size and weight reduction.
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所有功能
- AEC-Q101 qualified
- Very low RDS(on) over the entire temperature range
- High speed switching performances
- Very fast and robust intrinsic body diode
- Source sensing pin for increased efficiency
所有资源
| 资源标题 | 版本 | 更新时间 |
|---|
产品规格 (1)
| 资源标题 | 版本 | 更新时间 | ||
|---|---|---|---|---|
| 1.0 | 29 Sep 2022 | 29 Sep 2022 |
应用手册 (4)
| 资源标题 | 版本 | 更新时间 | ||
|---|---|---|---|---|
| 1.0 | 05 Mar 2025 | 05 Mar 2025 | ||
| 1.0 | 09 Apr 2015 | 09 Apr 2015 | ||
| 1.0 | 15 Jul 2019 | 15 Jul 2019 | ||
| 1.0 | 24 May 2010 | 24 May 2010 |
技术文档 (4)
| 资源标题 | 版本 | 更新时间 | ||
|---|---|---|---|---|
| 2.0 | 13 Feb 2015 | 13 Feb 2015 | ||
| 2.0 | 01 Apr 2025 | 01 Apr 2025 | ||
| 2.0 | 22 May 2019 | 22 May 2019 | ||
| 2.0 | 23 Nov 2023 | 23 Nov 2023 |
用户手册 (1)
| 资源标题 | 版本 | 更新时间 | ||
|---|---|---|---|---|
| 1.0 | 26 Nov 2013 | 26 Nov 2013 |
宣传册 (5 of 9)
| 资源标题 | 版本 | 更新时间 | ||
|---|---|---|---|---|
| 1.0 | 18 Nov 2020 | 18 Nov 2020 | ||
| 1.0 | 08 May 2020 | 08 May 2020 | ||
| 1.0 | 29 Apr 2024 | 29 Apr 2024 | ||
| 1.0 | 17 Jul 2024 | 17 Jul 2024 | ||
| 1.0 | 26 Jul 2024 | 26 Jul 2024 | ||
| 1.0 | 01 Feb 2021 | 01 Feb 2021 | ||
| 1.0 | 15 Oct 2020 | 15 Oct 2020 | ||
| 1.0 | 15 May 2020 | 15 May 2020 | ||
| 3.0 | 01 Aug 2015 | 01 Aug 2015 |
会议文章 (5 of 8)
| 资源标题 | 版本 | 更新时间 | ||
|---|---|---|---|---|
| 1.0 | 23 Jul 2018 | 23 Jul 2018 | ||
| 1.0 | 29 Apr 2021 | 29 Apr 2021 | ||
| 1.0 | 01 Aug 2015 | 01 Aug 2015 | ||
| 1.0 | 25 Jul 2018 | 25 Jul 2018 | ||
| 1.0 | 25 Jul 2018 | 25 Jul 2018 | ||
| 1.0 | 23 Jul 2018 | 23 Jul 2018 | ||
| 1.0 | 23 Jul 2018 | 23 Jul 2018 | ||
| 1.0 | 23 Aug 2021 | 23 Aug 2021 |
EDA符号、封装和3D模型
意法半导体 - SCT012H90G3AG
Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.
Please select one model supplier :
符号
封装
3D模型
所有资源
| 资源标题 | 版本 | 更新时间 |
|---|
SPICE models (1)
| 资源标题 | 版本 | 更新时间 | ||
|---|---|---|---|---|
| ZIP | 1.0 | 10 Oct 2022 | 10 Oct 2022 |
质量与可靠性
| 产品型号 | Marketing Status | 包 | 等级规格 | 符合RoHS级别 | Longevity Commitment | Longevity Starting Date | 材料声明** |
|---|---|---|---|---|---|---|---|
| SCT012H90G3AG | 批量生产 | H2PAK-7 | 汽车应用 | Ecopack1 | 10 | 2024-06-14T00:00:00.000+02:00 |
(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此，它们可能不是100%适用于特定的设备。有关特定设备的信息，请联系 销售支持。
样片和购买
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| 产品型号 | 供货状态 | Budgetary Price (US$)*/Qty | 从ST订购 | Order from distributors | 包 | 包装类型 | RoHS | Country of Origin | ECCN (US) | ECCN (EU) | Operating Temperature (°C) (min) | Operating Temperature (°C) (max) | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| SCT012H90G3AG | | | 1 distributors |
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